GC-4 THERMAL PASTE

The State-of-the-Art Thermal Compound, Ultimate Heat Conductivity, Non-Electrical Conductive, Ultra-Durable & Non-Curing, No Bleeding & User

Gelid’s GC-4 is a cutting-edge thermal compound that combines enhanced thermal filler particles, a polymer matrix, and other features to deliver

GC-4 Thermal Paste, 1g

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GC-PRO THERMAL PASTE - 5 Grams - 7 W/mK Compound and Applicator by GELID Solutions

Ultimate Heat Conductivity To provide the best thermal interface and to achieve ultra-efficient heat transfer from you CPU, GP and Chipset in mission

Gelid Solutions GC-4-3.5g Thermal Compound for Heat Sinks | Maximum Thermal Conductivity | Easy to use | Non-Corrosive

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Ultimate Heat Conductivity To provide the best thermal interface and to achieve ultra-efficient heat transfer from you CPU, GP and Chipset in mission

Gelid Solutions GC-4-3.5g Thermal Compound for Heat Sinks | Maximum Thermal Conductivity | Easy to use | Non-Corrosive

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The GC-Pro is made from the purest thermal conducting materials and offers outstanding thermal properties. Thanks to nano scale produced ultra-fine molecular structure the GC-Pro fills spaces more effectively than conventional materials and therefore it provides uniform thermal contact with enhanced heat transfer properties. Created for professionals the GC-Pro thermal compound ensures the best-in-class performance for your CPU, VGA or Chipset heatsink applications.

Gelid GC-Pro Thermal Paste, 5G

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